With the surge in demand for large model training and inference computing power, high bandwidth memory HBM has become the fastest-growing sub category in the storage market. Samsung Electronics stated that it is accelerating the production capacity of HBM3E and advancing the research and development of more advanced HBM4 to meet the order demands of leading AI chip manufacturers. HBM adopts a stacked packaging process, which requires extremely high yield and heat dissipation design, and has a longer capacity ramp up cycle than traditional DRAM. The industry expects that the proportion of HBM in the total storage output value will significantly increase in the next two years, becoming the focus of competition between original factories and packaging and testing processes.